Workpiece storage system, method of storing workpiece, and method of transferring workpiece using the same

ABSTRACT

A method for storage a workpiece used in fabrication of a semiconductor device includes disposing the workpiece on a workpiece carrier, disposing the workpiece carrier with the workpiece in a workpiece container via a workpiece storage system, identifying a content of the workpiece container, and adjusting a storage condition inside the workpiece container in response to the content of the workpiece container via the workpiece storage system.

PRIORITY CLAIM AND CROSS-REFERENCE

This application claims priority to U.S. provisional application Ser.No. 62/725,198, filed on Aug. 30, 2018, which is hereby incorporated byreference in its entirety.

BACKGROUND

In the semiconductor manufacturing industry, a semiconductor fabricationfacility (FAB) may include one or more floors having a plurality ofprocessing bays therein. The processing bays may be furnished withvarious processing tools and/or wafer storing equipment for performingvarious semiconductor manufacturing processes. In order to automaticallyhandle and transport a group of workpieces like wafers between thevarious processing tools and/or wafer storing equipment, an automatedmaterial handling system (AMHS) is widely used in the FAB. Consequently,the AMHS may transport different types of the workpieces to theircorresponding storage spaces respectively.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 is a schematic diagram illustrating a workpiece storage system inaccordance with some embodiments of the present disclosure.

FIG. 2 is a schematic diagram illustrating a workpiece container inaccordance with some embodiments of the present disclosure.

FIG. 3A is a schematic diagram illustrating a perspective view of aworkpiece carrier in accordance with some embodiments of the presentdisclosure.

FIG. 3B is a schematic diagram illustrating a cross-section view takingalong line A-A′ of FIG. 3A.

FIG. 4 is a schematic diagram illustrating a control module inaccordance with some embodiments of the present disclosure.

FIG. 5 is a schematic diagram illustrating the workpiece containers, atransport module, an identification module, and a control module of FIG.1 in accordance with some embodiments of the present disclosure.

FIG. 6 is a schematic diagram illustrating a gas distribution module,the identification module, and the control module in FIG. 1 inaccordance with some embodiments of the present disclosure.

FIG. 7 is a schematic diagram illustrating a stocker, the identificationmodule, and the control module of FIG. 1 in accordance with someembodiments of the present disclosure.

FIG. 8 is a flowchart illustrating a method for storing at least oneworkpiece in accordance with some embodiments of the present disclosure.

FIG. 9 is a flowchart illustrating a method for processing at least oneworkpiece in accordance with some embodiments of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one component or feature's relationship toanother component(s) or feature(s) as illustrated in the figures. Thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. The apparatus may be otherwiseoriented (rotated 90 degrees or at other orientations) and the spatiallyrelative descriptors used herein may likewise be interpretedaccordingly.

As used herein, “around,” “about,” “substantially” or “approximately”shall generally mean within 20 percent, within 10 percent, or within 5percent of a given value or range. Numerical quantities given herein areapproximate, meaning that the term “around,” “about,” “substantially” or“approximately” can be inferred if not expressly stated.

In a semiconductor fabrication facility (FAB), a variety of workpieces(e.g., finished products, semi-finished products, photomasks) arefrequently transported between various processing tools in correspondingbays, so as to carry out different semiconductor manufacturingprocesses. When these workpieces are in an idle state and/or waiting forthe next semiconductor manufacturing process, a variety of stockers inthe FAB may be used to temporarily store these workpieces. However,these workpieces are mostly stored in different storage conditions, sothat these workpieces may not be stored in the same place. The stockersoccupy a large storage area in FAB, but most of the stockers are in theidle states. Further, if these workpieces are put in the same place,there may be a risk of mutual contamination between these workpieces.Consequently, in an effort to adequately address the above-mentionedissues, a workpiece container, a workpiece storage system, and a methodof storing a workpiece are presented in accordance with variousembodiments of the present disclosure as follows.

Reference is made to FIG. 1, which is a schematic diagram illustrating aworkpiece storage system 10 in accordance with some embodiments of thepresent disclosure. In some embodiments, the workpiece storage system 10of the present disclosure may mainly include at least one workpiececontainer 100, a transport module 200, at least one identificationmodule 300, a gas distribution module 500, at least one stocker 600, anda control module 400, so as to carry out the method of storing aworkpiece of the present disclosure. The control module 400 mayinterconnect between each module mentioned above to facilitate functionof the workpiece storage system 10. In some embodiments, the workpiecestorage system 10 may include a plurality of identification module 300respectively at different positions in FAB. In order to make the systemand method more understood, more detailed descriptions thereof will besequentially and discretely presented as follows.

Reference is made to FIG. 2, which is a schematic diagram illustratingthe workpiece container 100 in accordance with some embodiments of thepresent disclosure. More specifically, the workpiece container 100 maybe a front opening unified pod (FOUP), a standard mechanical interface(SMIF) container, combinations thereof, or the like. In someembodiments, as shown in FIG. 1, the workpiece container 100 includes ahousing 110, a supporting structure 120, and at least one workpiececarrier 130. The housing 110 defines an internal space 112 therein thatmay be accessible through a detachable cover (e.g., a front opening) ofthe housing 110. The supporting structure 120 may include a plurality ofsupports that are respectively configured on inner sidewalls of thehousing 110. Each workpiece carrier 130 may be a movable platform withadjustable structures to retain one of different types of workpiecesthereon.

In some embodiments, as shown in FIG. 2, through the supportingstructure 120, a variety of workpieces may be positioned in the internalspace 112 of the housing 110.

It is noted that, with respect to the supporting structure 120, twohorizontally adjacent supports thereof may collectively form a floorthereof, so that a plurality of floors may be provided in the internalspace 112 of the housing 110 for containing a plurality of workpiecesthereon. For example, a wafer S1 may be directly positioned on one ofthe floors of the supporting structure 120. For another example, a waferpod S2 and a photomask box S3 may be retained by different workpiececarriers 130 respectively, and then, separately positioned on differentfloors of the supporting structure 120. It is also noted that thevertical distance and/or the horizontal distance between two adjacentsupports of the supporting structure 120 may be adjustable based onvarious designs, such that a variety of workpieces with different widthsmay be fit in the supporting structure 120. In other words, differenttypes of workpieces may be selectively positioned inside the workpiececontainer 100 at the same time, so as to render the following adaptablestorage of the various workpieces. Consequently, applicability of theworkpiece container 100 may be improved.

It is noted that the aforementioned workpiece may be any of the groupincluding wafer, wafer box, wafer pod, photomask box, photomask pod,standard mechanical interface (SMIF) device, combinations thereof, orthe like. Additionally, the workpiece may be a finished product or asemi-finished product.

In some embodiments, as shown in FIG. 2, a bottom wall 114 of thehousing 110 is equipped with at least one gas inlet 116 at one side ofthe housing 110 and at least one gas outlet 118 at another side of thehousing 110. Through the gas inlet 116 and the gas outlet 118, the gasdistribution module 500 (as shown in FIG. 1) may be in gaseouscommunication with the internal space 112 of the workpiece container100. It is noted that different number and positioning of the gas inlet116 and the gas outlet 118 are contemplated and within the scope of thepresent disclosure.

In some embodiments, the workpiece container 100 may include a roboticflange 140. The robotic flange 140 may be a protruding structure on thetop of the housing 110. In some embodiments, the robotic flange 140 maybe installed at the center of the top surface of the housing 110, suchthat the transport module 200 (e.g., an overhead hoist transfer (OHT) asshown in FIG. 1) in a FAB may stably lift up the workpiece container 100by grasping the robotic flange 140. In some embodiments, the workpiececontainer 100 may include a pair of handles 150. The pair of handles 150may be respectively configured on outer sidewalls of the housing 110.Further, the pair of handles 150 may be attached to opposite outersidewalls of the housing 110 to facilitate carrying of the workpiececontainer 100 by the transport module 200 and/or a FAB employee. In someembodiments, inclination of the handles 150 may be adjustable to makethe carrying of the workpiece container 100 more convenient.

Reference is made to FIGS. 3A and 3B. FIG. 3A is a schematic diagramillustrating a perspective view of the workpiece carrier 130 inaccordance with some embodiments of the present disclosure. FIG. 3B is aschematic diagram illustrating a cross-section view taking along lineA-A′ of FIG. 3A. More specifically, the workpiece carrier 130 includes aplatform 132, a plurality of bores 133 (as shown in FIG. 3B), aplurality of springs 134, a plurality of pins 136, and a support portion138. The platform 132 has a hollow 1322 that penetrates through theplatform 132 and forms a void in the platform 132. The bores 133 areformed in the platform 132 and distributed around the hollow 1322. Thesprings 134 are configured in the bores 133. The pins 136 are attachedonto the springs 134 respectively. When one of the aforementionedworkpieces is loaded on a portion of the pins 136, the springs 134 underthe portion of the pins 136 are pressed, such that the portion of thepins 136 may vertically descend in the corresponding bores 133.Conversely, when one of the aforementioned workpieces is unloaded fromthe portion of the pins 136, the springs 134 under the portion of thepins 136 may generate a resilient force after being pressed, such thatthe portion of the pins 136 may vertically ascend to their initialposition.

In some embodiments, the platform 132 may have a variety of profilesviewed from a top direction, e.g., a rectangular profile as shown inFIGS. 3A and 3B. The profile of the platform 132 may be adjustable basedon configuration of the supporting structure 120 and/or shape of theworkpiece loaded thereon, so as to improve the storage stability of theworkpiece. On the other hand, in some embodiments, the support portion138 may have a pair of plate-shaped structures that horizontally extendbeyond opposite sidewalls of the platform 132 to enable positioning ofthe workpiece carrier 130 in the supporting structure 120 (as shown inFIG. 1). It is noted that dimension (e.g., width, length, and/orthickness) of the plate-shaped structure may be adjustable based onconfiguration of the supporting structure 120 and/or profile of theplatform 132, such that the workpiece carrier 130 may be firmlysupported by the supporting structure 120.

In some embodiments, the hollow 1322 may have a cross-shaped profileviewed from a top direction. Due to the configuration of the hollow1322, a gripper 208 (as shown in FIG. 5) of the transport module 200(e.g., an overhead hoist transfer (OHT)) may pass through the hollow1322 to load a workpiece on the platform 132 or unload a workpiece fromthe platform 132 along a vertical direction. In some embodiments, asshown in FIG. 3A, the hollow 1322 may have an opening 1324 that isformed at a front side of the platform 132, such that an arm of thetransport module 200 (e.g., a rail guided vehicle (RGV), an automatedguided vehicle (AGV), or the like) may pass through the hollow 1322 andthe opening 1324 to load a workpiece on the platform 132 or unload aworkpiece from the platform 132 along vertical and horizontaldirections. It is noted that configurations (e.g., profile shape andposition on the platform 132) of the hollow 1322 may be adjustable basedon various designs. For example, in some embodiments, the hollow 1322may have an enclosed profile, i.e., the opening 1324 is omitted, suchthat structural strength of the workpiece carrier may be increased.

In some embodiments, as shown in FIG. 3B, the bores 133 may be formed ona top surface 1326 of the platform 132 and extend toward a bottomsurface of the platform 132. Further, each of the bores 133 may be ablind hole, which does not penetrate through the platform 132, such thateach of the bores 133 may have a bore bottom 1332 where each of thesprings 134 is correspondingly disposed thereon. Each of the springs 134may have two ends that are in contact with the corresponding pin 136 andthe corresponding bore bottom 1332 respectively. In other words, a pin136 may be connected with a bore bottom 1332 through a spring 134.Consequently, when a workpiece is loaded on or unloaded from the pins136, the pins 136 may be movable along a vertical direction in thecorresponding bores 133 due to operation of the springs 134.

In some embodiments, each of the pins 136 may have an elongatedstructure. When the workpiece carrier 130 is free of a workpiece, a topportion 1362 of each of the pins 136 may be located above the topsurface 1326 of the platform 132 and a bottom portion 1364 of each ofthe pins 136 may be located inside the corresponding bore 133, such thatthe pins 136 may be stably held by the corresponding bores 133, so as tofacilitate moving of the pins 136 therein. It is noted that a profile ofthe bore 133 (viewed from a top direction) may be correspondent with across section of the pin 136, such that the pins 136 may be restrainedto substantially move along a vertical direction. In some embodiments,as shown in FIG. 1, when a workpiece (i.e., the wafer pod S2 or thephotomask box S3) is loaded on the workpiece carrier 130, the pressedpins 136 may be downwardly moved to make the workpiece descendsimultaneously, such that the other pins 136 that remain at theirinitial positions may collectively act as a fence to surround sides ofthe workpiece and thus prevent the workpiece from moving.

In some embodiments, the pins 136 are arranged in an array distributionthat surrounds the hollow 1322. More specifically, the pins 136 are heldby the platform 132 and parallel to one another in a series of columnsand rows, such that top portions 1362 of the pins 136 may collectivelyform a flat virtual plane that is adaptable to a variety of workpieceswith different shapes. For example, as shown in FIGS. 2, 3A, and 3B, thepins 136 are arranged in a 4×4 distribution on the platform 132. When aworkpiece is loaded on the workpiece carrier 130, the inner four pins136 may be pressed to descend and the outer twelve pins 136 may remainat their initial positions to abut against sides of the workpiece. It isnoted that number of the pins 136 may be adjustable based on variousdesigns, e.g., the pins 136 may be arranged in a n×m distribution (e.g.,the n and m may be any of positive integers). Consequently, theworkpiece may be firmly settled on the workpiece carrier 130 through thepins 136.

In addition to the aforementioned array distribution, the pins 136 maybe also arranged in a variety of distributions based on a profile of aworkpiece (viewed from a top direction), e.g., in a circulardistribution. Further, a density of the pins 136 may be adjustable basedon various designs, such that the workpiece carrier 130 can be moreadaptable to workpieces with different profile (viewed from a topdirection).

In some embodiments, the workpiece carrier 130 may include at least onestorage condition sensor 135. More specifically, the storage conditionsensor 135 is capable of detecting a storage condition (e.g.,temperature, humidity, gas ingredient, and total organic carbon (TOC))in the workpiece container 100 when the workpiece carrier 130 ispositioned inside the workpiece container 100. For example, the storagecondition sensor 135 may be a temperature sensor, a humidity sensor, agas sensor, or combinations thereof. Subsequently, the storage conditionsensor 135 may be communicated with the control module 400 (as shown inFIG. 7) of the workpiece storage system 10, e.g., in a wireless manner,so as to monitor the storage condition of the internal space 112 of theworkpiece container 100. It is noted that the position of the storagecondition sensor 135 in FIG. 3A is illustrative and not meant to limitthe present disclosure. Embodiments fall within the present disclosureas long as the storage condition sensor 135 is arranged on the workpiececarrier 130. In some embodiments, the workpiece carrier 130 may furtherinclude an identification member, such as a barcode, a string ofnumbers/characters, and/or a radio frequency identification (RFID)component, to enable identification of the workpiece loaded thereon. Insome embodiments, the identification member may be coordinated with thestorage condition sensor 135 as a multifunctional component. That is,the identification member is combined with the storage condition sensor135. In some other embodiments, the storage condition sensor 135 and theidentification member are both positioned on the workpiece carrier 130but at different positions.

Reference is made to FIG. 4, which a schematic diagram illustrating thecontrol module 400 in accordance with some embodiments of the presentdisclosure. In some embodiments, the control module 400 may be alsoknown as a computer system. As shown in FIG. 4, an illustration of anexemplary computer system in which various embodiments of the presentdisclosure can be implemented, according to some embodiments. Thecomputer system may be used to control various components in theworkpiece storage system 10. The computer system may be any well-knowncomputer capable of performing functions and operations described in thepresent disclosure. For example, and without limitation, the computersystem may be capable of processing and transmitting signals. Thecomputer system may be used, for example, to execute one or morefunctions of the workpiece storage system 10, which describes exampleoperations of communications amongst different components therein.

The computer system may include one or more processors (also calledcentral processing units, or CPUs), such as a processor 404. Theprocessor 404 is connected to a communication infrastructure or bus 406.The computer system also includes input/output device(s) 403, such asmonitors, keyboards, and pointing devices, that may communicate withcommunication infrastructure or bus 406 through input/outputinterface(s) 402. The computer system may receive instructions toimplement functions and operations described herein, e.g., functions ofthe workpiece storage system 10 and method M1, via the input/outputdevice(s) 403. The computer system also includes a main or primarymemory 408, such as random access memory (RAM). The main memory 408 mayinclude one or more levels of cache. The main memory 408 has storedtherein control logic (e.g., computer software) and/or data. In someembodiments, the control logic (e.g., computer software) and/or data mayinclude one or more of the functions described with respect to theworkpiece storage system 10.

The computer system may also include one or more secondary storagedevices or memory 410. The secondary memory 410 may include, forexample, a hard disk drive 412 and/or a removable storage device ordrive 414. Removable storage drive 414 can be a floppy disk drive, amagnetic tape drive, a compact disk drive, an optical storage device,tape backup device, and/or any other storage device/drive.

The removable storage drive 414 may interact with a removable storageunit 418. The removable storage unit 418 includes a computer usable orreadable storage device having stored thereon computer software (controllogic) and/or data. The removable storage unit 418 may be a floppy disk,magnetic tape, compact disk, DVD, optical storage disk, and/any othercomputer data storage device. The removable storage drive 414 reads fromand/or writes to removable storage unit 418 in a well-known manner.

In some embodiments, the secondary memory 410 may include other means,instrumentalities or other approaches for allowing computer programsand/or other instructions and/or data to be accessed by the computersystem. Such means, instrumentalities or other approaches can include,for example, a removable storage unit 422 and an interface 420. Examplesof the removable storage unit 422 and the interface 420 may include aprogram cartridge and cartridge interface (such as that found in videogame devices), a removable memory chip (such as an EPROM or PROM) andassociated socket, a memory stick and USB port, a memory card andassociated memory card slot, and/or any other removable storage unit andassociated interface. In some embodiments, the secondary memory 410, theremovable storage unit 418, and/or the removable storage unit 422 mayinclude one or more of the functions described with respect to theworkpiece storage system 10.

The computer system may further include a communication or networkinterface 424. The communication interface 424 enables the computersystem to communicate and interact with any combination of remotedevices, remote networks, remote entities, etc. (individually andcollectively referenced by reference number 428). For example, thecommunication interface 424 may allow the computer system to communicatewith the remote devices 428 over the communications path 426, which maybe wired and/or wireless, and which may include any combination of LANs,WANs, the Internet, etc. Control logic and/or data may be transmitted toand from the computer system via the communication path 426.

The functions and/or operations in the preceding embodiments may beimplemented in a wide variety of configurations and architectures.Therefore, some or all of the operations in the preceding embodiments,e.g., functions of the workpiece storage system 10 and method M1, may beperformed in hardware, in software or both. In some embodiments, atangible apparatus or article of manufacture including a tangiblecomputer useable or readable medium having control logic (software)stored thereon is also referred to herein as a computer program productor program storage device. This includes, but is not limited to, thecomputer system, the main memory 408, the secondary memory 410, and theremovable storage units 418 and 422, as well as tangible articles ofmanufacture embodying any combination of the foregoing. Such controllogic, when executed by one or more data processing devices (such as thecomputer system), causes such data processing devices to operate asdescribed in the present disclosure. In some embodiments, the computersystem includes hardware/equipment for the manufacturing of photomasksand circuit fabrication. For example, the hardware/equipment may beconnected to or be part of the element 428 (remote device(s),network(s), entity(ies)) of the computer system.

Reference is made to FIG. 5, which is a schematic diagram illustratingthe workpiece containers 100, the transport module 200, theidentification module 300, and the control module 400 of FIG. 1 inaccordance with some embodiments of the present disclosure. It is notedthat, the FAB may include one or more floors on which a plurality ofprocessing bays are positioned, and further, a processing bay mayinclude various processing tools and/or wafer storing equipment. Inorder to interconnect the various processing tools, wafer storingequipment, processing bays, and other facilities in the FAB, thetransport module 200 is installed. More specifically, the transportmodule 200 may include various types of automated and manual vehiclesfor moving and transporting a plurality of workpieces throughout the FABduring semiconductor manufacturing processes.

In some embodiments, the transport module 200 is an automated materialhandling system (AMHS) that may include at least one of overhead hoisttransfer (OHT), overhead shuttle (OHS), rail guided vehicle (RGV),automated guided vehicle (AGV), personal guided vehicle (PGV), orcombinations thereof. Consequently, a plurality of workpiece containers100 may be controllably and fluently transported between variousprocessing tools, stockers, and processing bays to facilitatemanufacturing of semiconductor products. That is, due to theconfiguration of the transport module 200, inter-bay connection and/orintra-bay connection may be achieved.

In some embodiments, as shown in FIG. 5, the transport module 200 mayinclude an overhead hoist transfer (OHT) 201, and the FAB may furtherinclude a processing tool E1 and a staging equipment E2 (or a relaystation). More detailed descriptions about these components will besequentially presented as follows.

In some embodiments, the OHT 201 may include a rail 202 and one or moreOHT vehicles 204 that are movable on the rail 202. The rail 202 isoperable to support and guide movement of the one or more OHT vehicles204. For example, the one or more OHT vehicles 204 may be suspended fromthe rail 202 and transported thereon. In some embodiments, the rail 202may include a monorail affixed to and suspended from the ceiling of theFAB. On the other hand, the OHT vehicle 204 may carry and transport theworkpiece container 100 within each processing bay (i.e., the intra-baymovement) or between different processing bays (i.e., the inter-baymovement). In some embodiments, each OHT vehicle 204 may hold oneworkpiece container 100 at a time and transport the workpiece container100 along a substantially horizontal direction (as represented by thesolid horizontal double-head arrow in FIG. 5). Additionally, the OHTvehicle 204 may include one or more gripper arm 206 and a gripper 208.The gripper arm 206 may be extendable and retractable from the OHTvehicle 204 to reach a workpiece container 100 therebelow. The gripper208 may be coupled to an end of the gripper arm 206 for grasping therobotic flange 140 of the workpiece container 100. Consequently, theworkpiece container 100 may be picked up, held, raised, lowered, and/orreleased by the OHT vehicle 204 at a load port of equipment, e.g., theprocessing tool E1 and/or the staging equipment E2.

For example, as shown in FIG. 5, the OHT 201 may grasp a workpiececontainer 100 by the gripper 208 of the OHT vehicle 204 at the load portof the processing tool E1. Subsequently, the workpiece container 100 maybe raised by the gripper arm 206 of the OHT vehicle 204, held by the OHTvehicle 204, and transported through the rail 202. After beingtransported, the workpiece container 100 may be unloaded at the loadport of the staging equipment E2. It is noted that transportation of theworkpiece container 100 is not limited to the aforementionedembodiments, e.g., the workpiece container 100 may be transportedbetween various processing tools, stockers, staging equipment, or otherpossible manufacturing devices in the FAB.

As shown in FIG. 5, the identification module 300 may be coordinatedwith the processing tool E1 and configured to identify a content of theworkpiece container 100. More specifically, the identification module300 may detect the workpiece container 100 by means of optical markrecognition (OMR), radio frequency identification (RFID), or acombination thereof.

In some embodiments, the identification module 300 that utilizes theoptical mark recognition technique may include an optic inspectioninstrument, such as a scanner, that may project a radiation onto anobject and analyze the reflected radiation from the object. For example,the identification module 300 may scan an identification area (e.g., abarcode, a pattern, combinations thereof, or the like, may be arrangedtherein) which may be imprinted on the workpiece container 100 so as toacquire information about the contained workpiece therein. It is notedthat scanning of the identification module 300 is not limited by theaforementioned embodiments, e.g., the identification module 300 maydirectly scan the workpiece carrier 130 and/or a workpiece thereon.

In some other embodiments, the identification module 300 that utilizesthe radio frequency identification (RFID) technique may include a sensorand/or an antenna that may interact with a RFID tag on the workpiececontainer 100 and manage information stored in the RFID tag. The RFIDtag may contain a variety of information, such as content and/orprocessing instruction of the workpiece container 100. Further, when theworkpiece container 100 is positioned at the load port of the processingtool E1, the identification module 300 may read and/or write informationin the RFID tag attached thereon, so as to facilitate the semiconductormanufacturing processes. In some embodiments, the RFID technique may beapplied to the workpieces, the workpiece carrier 130, and/or theworkpiece container 100, such that data transmission of the workpiecestorage system 10 may be further improved.

In some embodiments, the identification module 300 is communicated withthe control module 400. The control module 400 may includecomputer-supported equipment that is capable of manipulating thesemiconductor manufacturing processes. For example, after receivinginformation from the identification module 300, the control module 400may analyze the information to accordingly determine and proceed withsubsequent manufacturing processes (e.g., transport destination of theworkpiece container 100 may be determined). Additionally, in someembodiments, the control module 400 may have a graphical user interface(GUI) that may enable contact control, for example, by a FAB employee.

Reference is made to FIG. 6, which is a schematic diagram illustratingthe gas distribution module 500, the identification module 300, and thecontrol module 400 in FIG. 1 in accordance with some embodiments of thepresent disclosure. More specifically, the gas distribution module 500may include a pair of distribution ducts, a gas supply device 510, and asensor 540. Further, after the identification module 300 identifies theworkpiece container 100 at the processing tool E1 (as shown in FIG. 5)or near the gas distribution module 500, the control module 400 mayacquire information about the workpiece container 100. Subsequently, thegas distribution module 500 may adjust a storage condition of theworkpiece container 100 based on the information from the control module400.

In some embodiments, the pair of distribution ducts includes a supplypipe 520 and an exhaust pipe 530 that are coupled to the gas inlet 116and the gas outlet 118 of the workpiece container 100 (as shown in FIG.2) respectively. Hence, a gas input path may be substantially separatedfrom a gas output path, so as to facilitate adjustment of the storagecondition. For example, the workpiece container 100 is positioned suchthat the gas inlet 116 of the workpiece container 100 is coupled to thesupply pipe 520 and the gas outlet 118 of the workpiece container 100 iscoupled to the exhaust pipe 530, thus allowing the gas distributionmodule 500 to perform the storage condition control of the workpiececontainer 100 through the gas inlet 116 and the gas outlet 118.

In some embodiments, the gas supply device 510 is connected to theworkpiece container 100 by the supply pipe 520, so as to clean theinternal space 112 of the workpiece container 100 and/or adjust thestorage condition therein (e.g., temperature, humidity, gas ingredient,and total organic carbon (TOC)) by injecting a gas. Additionally, thegas supply device 510 may include a variety of indicators that may showparameters and/or kinds of the gas injected into the workpiece container100. For example, as show in FIG. 6, the gas supply device 510 has aplurality of indicator lights 512 that may represent a variety of gasesrespectively, such as nitrogen (N₂) and ultra clean dry air (XCDA).

In some embodiments, the sensor 540 is positioned in the exhaust pipe530, so as to detect the storage condition (e.g., temperature, humidity,gas ingredient, and total organic carbon (TOC)) inside the workpiececontainer 100 through a gas outflowing therefrom and/or check whether agas leak issue happens to the workpiece container 100. In someembodiments, the sensor 540 may be coupled to a processor 550 that isadjacent to the sensor 540 and interconnects with the control module400. The processor 550 may analyze information from the sensor 540 andoutput an analyzation result to the control module 400 to facilitatesubsequent reactions (e.g., adjusting the storage condition of theworkpiece container 100). In some embodiments, the processor 550 may beequipped with a screen displaying the analyzation result thereon, suchthat observation of the analyzation result may be more convenient. Insome embodiments, the processor 550 may raise an alarm through anysuitable means when the analyzation result shows that the storagecondition of the workpiece container 100 is not suitable or the gas leakissue happens to the workpiece container 100. In some other embodiments,the sensor 540 may directly interconnect with the control module 400,and the processor 550 may be omitted.

In some embodiments, the control module 400 may selectively interconnectwith the workpiece container 100, the storage condition sensor 135 ofthe workpiece carrier 130 (as shown in FIG. 3A), the identificationmodule 300, the gas supply device 510, and/or the processor 550. Hence,the storage condition of the internal space 112 of the workpiececontainer 100 may be appropriately adjusted and maintained under closesurveillance.

Reference is made to FIG. 7, which is a schematic diagram illustrating astocker 600, the identification module 300, and the control module 400of FIG. 1 in accordance with some embodiments of the present disclosure.More specifically, the stocker 600 may include a housing 602 that hasmultiple storage shelves (or bins) 604 for temporarily storing aplurality of workpiece containers 100. In some embodiments, a load portE3 may be positioned adjacent to the stocker 600 as a relay station.Additionally, a robotic crane 220 of the transport module 200 may beconfigured near the stocker 600, so as to make the workpiece container100 positioned into and/or retrieved from the stocker 600. In someembodiments, the control module 400 may interconnect with the roboticcrane 220 and the stocker 600, such that positioning of the workpiececontainers 100 may be well-organized. In some embodiments, theidentification module 300 may be configured near the load port E3 and/orthe stocker 600. The identification module 300 may double-check whetherthe workpiece container 100 is correctly transported to the designatedstocker 600 or whether the workpiece(s) is correctly classified andpositioned into the workpiece container 100.

Since the workpiece container 100 of the present disclosure may retaindifferent types of workpieces therein at the same time, there would beno need to install various types of stockers in the FAB. Additionally,the workpiece container 100 may also provide independent storageenvironments to the different types of workpieces respectively.Consequently, relevant workpieces (e.g., wafer and photomask) of asemiconductor manufacturing process may be stored together in a stockeradjacent to a corresponding processing tool.

Reference is made to FIG. 8, which is a flowchart illustrating a methodM1 for storing at least one workpiece in accordance with someembodiments of the present disclosure. For illustration purposes, theworkpiece storage system 10 mentioned above is referenced tocollectively describe the details of the method. It is noted that eachof the methods presented below is merely an example, and not intended tolimit the present disclosure beyond what is explicitly recited in theclaims. Additional operations may be provided before, during, and aftereach of the methods. Some operations described may be replaced,eliminated, or moved around for additional embodiments of thefabrication process. Additionally, for clarity and ease of explanation,some elements of the figures have been simplified.

The operation S10 includes classifying a plurality of workpieces. Morespecifically, the workpiece may include wafer, wafer box, wafer pod,photomask box, photomask pod, standard mechanical interface (SMIF)device, combinations thereof, or the like. Further, the workpiece mayalso include finished product and/or semi-finished product ofsemiconductor devices. In some embodiments, a plurality of workpiecesmay be identified and classified into multiple groups according to avariety of characters (e.g., storage condition) through theidentification module 300 and the control module 400, so as to improvethe storage of the workpieces. For example, some workpieces (such as thewafer S1, the wafer pod S2, and the photomask box S3 in FIG. 2) may bestored in the same condition/environment, these three workpieces may beclassified as a group by the identification module 300 and the controlmodule 400. In the meantime, some other workpieces may be classified asanother group by the identification module 300 and the control module400 if they can be stored in another same condition/environment.

The operation S20 includes moving the workpieces toward differentworkpiece containers 100 respectively. More specifically, after beingclassified, the control module 400 may provide a command. The transportmodule 200 may receive the command and respectively moves the multiplegroups of the workpieces toward corresponding workpiece containers 100.For example, according to respective storage conditions, a workpiece maybe moved toward a workpiece container 100 while another workpiece may bemoved toward another workpiece container 100, such that suitable storageconditions may be separately provided to the workpiece containers 100through the following operations. For example, the wafer S1, the waferpod S2, and the photomask box S3 in FIG. 2 may be moved to the sameworkpiece container 100. In some embodiments, the various workpieces maybe identified and/or classified at different positions in the FAB (e.g.,the processing tool E1, the staging equipment E2, or the load port E3).Subsequently, the workpieces at different positions may be transportedtoward corresponding workpiece containers 100 to facilitate thefollowing operations.

After the workpieces are moved to be adjacent to corresponding workpiececontainers 100, at least one of the workpieces may be positioned in thesupporting structure 120 of the workpiece container 100 either directlyor through the workpiece carrier 130. More detailed descriptions aboutpositioning of the workpieces are presented as follows.

The operation S25 includes acquiring width information of theworkpieces. More specifically, as shown in FIG. 2, the supportingstructure 120 may have opposite portions located on opposite innersidewalls of the housing 110, and a horizontal distance between theopposite portions of the supporting structure 120 may be denoted as D.In some embodiments, when some workpieces (such as wafer pod S2 and thephotomask box S3) have widths W2 and W3 less than the distance D, theseworkpieces are unable to be supported directly by the supportingstructure 120. However, these workpieces may be loaded on the workpiececarrier 130, which is able to be supported by the supporting structure120. In some other embodiments, when a workpiece (such as the wafer S1)has a width W1 greater than the distance D, the workpiece may bedirectly supported by the supporting structure 120. In this operation,the control module 400 may acquire the width information of theworkpieces (e.g., from the identification data of the workpieces). Ifthe width of the workpiece is less than the distance D, the workpiecewill be loaded on the workpiece carrier 130. Conversely, if the width ofthe workpiece is greater than the distance D, the workpiece may bedirectly loaded on the supporting structure 120, or the workpiece may bealso loaded on the supporting structure 120 through the workpiececarrier 130.

The operation S30 includes loading one of the workpieces on oneworkpiece carrier 130. More specifically, as described above, theworkpiece (such as the wafer pod S2 and the photomask box S3) which hasa width less than the distance D may be loaded on the workpiece carrier130 before being positioned on the supporting structure 120. Theworkpiece carrier 130 may have a plurality of structural configurations,such as the platform 132, the hollow 1322, and the opening 1324. Thegripper 208 of the overhead hoist transfer (OHT) 201 as shown in FIG. 5may pass through the hollow 1322 to load one workpiece on the platform132 along a vertical direction. Additionally, an arm of the transportmodule 200 (e.g., a rail guided vehicle (RGV), an automated guidedvehicle (AGV), or the like) may also pass through the hollow 1322 andthe opening 1324 to load one workpiece on the platform 132 alongvertical and horizontal directions.

Further, when one workpiece (e.g., the wafer pod S2 and the photomaskbox S3) is loaded on the workpiece carrier 130, the pressed pins 136 maybe downwardly moved to make the workpiece descend simultaneously whilethe other pins 136 that remain at their initial positions maycollectively act as a fence to surround sides of the workpiece.Consequently, the workpiece may be stably positioned on the workpiececarrier 130.

The operation S40 includes positioning the workpiece carrier 130 in thesupporting structure 120 of the workpiece container 100, e.g., based ona height of the workpiece. More specifically, the identification module300 may identify a type of the workpiece (e.g., the wafer S1, the waferpod S2, and the photomask box S3 as shown in FIG. 2) by various meansmentioned above and also acquire information about the height of theworkpiece. For example, the wafer S1 may be identified and measured tohave a height T1. For another example, the wafer pod S2 may beidentified, and further, the wafer pod S2 and the workpiece carrier 130may be measured to have a height T2. For yet another example, thephotomask box S3 may be identified, and further, the photomask box S3and the workpiece carrier 130 may be measured to have a height T3.

In some embodiments, the identification module 300 and the controlmodule 400 may subsequently cooperate to determine where the workpieceshould be disposed in the workpiece container 100. More specifically,according to the height of the workpiece (e.g., the heights T1, T2, andT3), the control module 400 may calculate how many floors in thesupporting structure 120 of the workpiece container 100 are required forproviding sufficient space to the workpiece. Further, the control module400 may determine respective disposing positions of multiple workpieces.In some embodiments, if the wafer S1, the wafer pod S2, and thephotomask box S3 as shown in FIG. 2 require substantially the samestorage condition, these workpieces may be disposed in the supportingstructure 120 in any sequence thereof. For example, when the photomaskbox S3 on the workpiece carrier 130 has been disposed in one floor ofthe supporting structure 120, the wafer pod S2 on the workpiece carrier130 may be determined to be disposed in another floor of the supportingstructure 120 which is spaced apart from the floor for supporting thephotomask box S3 on the workpiece carrier 130 by a distance greater thanthe height T3. Further, the wafer S1 may be determined to be disposed inyet another floor of the supporting structure 120 which is spaced apartfrom the floor for supporting the wafer pod S2 on the workpiece carrier130 by a distance greater than the height T2. Therefore, collision ofthe wafer S1, the wafer pod S2, the photomask box S3, and the workpiececarriers 130 may be prevented.

Consequently, various workpieces with different widths and heights maybe disposed in the supporting structure 120 together, so as to achievethe adaptable storage of the various workpieces described below.

The operation S50 includes identifying the content of the workpiececontainer 100. More specifically, after various workpieces arepositioned in the workpiece container 100, the workpiece container 100may be sealed to make the interior thereof isolated from its surroundingenvironment. The workpiece container 100 is then transported to andloaded on the gas distribution module 500 by the transport module 200.Further, the identification module 300 may detect the workpiececontainer 100 by means of optical mark recognition (OMR), radiofrequency identification (RFID), combinations thereof, or the like.Consequently, a variety of information about the detected workpiececontainer 100, such as the content therein, may be acquired and analyzedby the control module 400 to facilitate the following operations.

The operation S60 includes cleaning the internal space 112 of theworkpiece container 100. More specifically, before adjusting the storagecondition of the internal space 112, the gas distribution module 500 mayclean up the internal space 112 through providing a gas flow thereinto,such that contamination (e.g., unwanted substance and/or gas) in theinternal space 112 may be substantially removed. Consequently, it may beassured that the storage condition of the internal space 112 remainsclean and appropriate for the following operations. It is noted that theoperation S60 may be selectively performed based on various designs. Forexample, in some embodiments, if the internal space 112 of the workpiececontainer 100 is already clean enough, the operation S60 may be omittedso as to expedite the semiconductor manufacturing processes.

The operation S70 includes injecting a gas into the workpiece container100 according to the identified content. More specifically, according tothe content of the workpiece container 100 acquired by theidentification module 300, the control module 400 may inform the gasdistribution module 500, such that the gas supply device 510 of the gasdistribution module 500 may provide the internal space 112 of theworkpiece container 100 with appropriate gas(es). Further, the storageenvironment of various workpieces (e.g., different types of wafers,wafer box, wafer pod, photomask box, photomask pod, standard mechanicalinterface (SMIF) device, combinations thereof, or the like) that havesubstantially the same demand for their storage condition may becorrespondingly adjusted. In some embodiments, the appropriate gas mayinclude nitrogen (N₂), ultra clean dry air (XCDA), other suitable gases,or the like. Consequently, the storage quality of the workpieces may beimproved.

In some embodiments, during injecting the gas into the workpiececontainer 100, both the supply pipe 520 and the exhaust pipe 530 areopen, such that the original gas in the internal space 112 may begradually pushed out by the injected gas. Further, the sensor 540 in theexhaust pipe 530 may detect whether the internal space 112 is completelyadjusted through the discharged gas. In some other embodiments, afterthe internal space 112 is purged, the internal space 112 may be vacuumedand subsequently provided with appropriate gas(es) to adjust the storagecondition therein.

The operation S80 includes controlling at least one of temperature,humidity, gas ingredient, and total organic carbon (TOC) inside theworkpiece container 100. More specifically, through injecting the gasinto the workpiece container 100, a variety of factors (e.g.,temperature, humidity, gas ingredient, and total organic carbon (TOC))pertaining to the storage condition of the internal space 112 may bedeliberately and separately controlled. For example, in order to heat upthe storage condition in the workpiece container 100, the gas supplydevice 510 may provide a gas with high temperature thereto. For anotherexample, in order to increase the humidity of the storage condition inthe workpiece container 100, the gas supply device 510 may provide aspecific amount of water vapor thereto. Further, the control module 400may analyze information from the sensor 540, the processor 550, and/orthe storage condition sensor 135 of the workpiece carrier 130, such thatthe gas distribution module 500 interconnected with the control module400 may be driven to control and fine-tune the various factors mentionedabove.

After the storage condition of the internal space 112 of the workpiececontainer 100 is appropriately adjusted, the workpiece container 100 maybe sealed, so as to make the interior thereof isolated from itssurrounding environment. Subsequently, in some embodiments, the controlmodule 400 and the gas distribution module 500 may collectively detectwhether a gas leak issue happens to the workpiece container 100 throughthe function of the sensor 540, the processor 550, and/or the storagecondition sensor 135 of the workpiece carrier 130. For example, afterthe workpiece container 100 is sealed, the sensor 540 may detect whethera discharged gas occur in the exhaust pipe 530. For another example, thestorage condition sensor 135 of the workpiece carrier 130 may detectwhether a pressure of the internal space 112 becomes lower. For yetanother example, the storage condition sensor 135 of the workpiececarrier 130 may detect whether a gas ingredient inside the internalspace 112 changes or not. Additionally, in some embodiments, ifoccurrence of the gas leak issue is confirmed by the control module 400,the control module 400 may restart either one of the operations S60 andS70 mentioned above, so as to ensure that the storage condition insidethe workpiece container 100 is appropriately adjusted and maintained.

The operation S90 includes transporting and storing the workpiececontainer 100 in a semiconductor fabrication facility (FAB). Morespecifically, a plurality of sealed workpiece containers 100 may berespectively moved by the transport module 200 to their designatedpositions in the FAB (e.g., processing tools E1, staging equipment E2,and stocker 600) based on various designs. In some embodiments, as shownin FIG. 7, a workpiece container 100 may be transported to the stocker600 and stored therein. In some other embodiments, a workpiece container100 may be transported and stored in a stocker close to a processingtool that may perform the next manufacturing process of a workpiece inthe workpiece container 100. Consequently, the workpiece storage system10 may efficiently manage transport and storage of various workpieces.In this way, fewer stockers can be disposed in the FAB, and each of thestockers can store different types of the workpieces. As such, thestorage space of the stocker can be efficiently used.

The operation S100 includes monitoring the storage condition inside theworkpiece container 100. More specifically, the control module 400 maysurveil the internal space 112 of the workpiece container 100 withrespect to various factors (e.g., temperature, humidity, gas ingredient,total organic carbon (TOC), or combinations thereof) through the storagecondition sensor 135 of the workpiece carrier 130 and/or other sensor(s)of the workpiece container 100. Consequently, it may be ensured that thestorage condition inside the workpiece container 100 is appropriatelymaintained. It is noted that the function timing of the operation S100is not intended to be limiting. For example, the operation S100 may beperformed at any timing after the workpiece container 100 is sealed.

Reference is made to FIG. 9, which is a flowchart illustrating a methodM2 for processing at least one workpiece in accordance with someembodiments of the present disclosure. For illustration purposes, theworkpiece storage system 10 mentioned above is referenced tocollectively describe the details of the method. It is noted that eachof the methods presented below is merely an example, and not intended tolimit the present disclosure beyond what is explicitly recited in theclaims. Additional operations may be provided before, during, and aftereach of the methods. Some operations described may be replaced,eliminated, or moved around for additional embodiments of thefabrication process. Additionally, for clarity and ease of explanation,some elements of the figures have been simplified.

The operation R10 includes locating a workpiece in FAB, e.g., in thestocker 600. More specifically, when a demand for the workpiece isprovided, the control module 400 may search for the location of theworkpiece (e.g., in the workpiece container 100 within the stocker 600).In some embodiments, through interconnect between the identificationmodule 300 and the workpiece carrier 130 (or the workpiece thereon), thecontrol module 400 may find out the location of the workpiece. In someembodiments, during the identification of the workpiece, the workpiececontainer 100 that contains the workpiece may remain sealed, such thatthe storage condition of the workpiece may be maintained.

The operation R20 includes transferring a workpiece container containingthe workpiece. More specifically, after the location of the workpiece ischecked, the transport module 200 may take out the workpiece container100 that contains the wanted workpiece from the stocker 600.Subsequently, the workpiece container 100 may be transferred to adesignated location in the FAB (e.g., the processing tool E1) for thefollowing manufacturing process.

The operation R30 includes checking whether the workpiece is correct.More specifically, when the workpiece container 100 is transferred tothe processing tool E1, the identification module 300 adjacent to theprocessing tool E1 would double-check whether the workpiece meets thedemand or not. Further, when the workpiece is correct (i.e., theworkpiece in the workpiece container 100 meets the demand), the controlmodule 400 may proceed with the following manufacturing process.Conversely, when the workpiece is incorrect (i.e., the workpiece in theworkpiece container 100 does not meets the demand), the control module400 may return the workpiece back to its original location (e.g., theworkpiece container 100 may be transported back to the stocker 600) or adesignated location in the FAB, and then, restart the operation R10.

The operation R40 includes identifying the demanded workpiece in theworkpiece container 100. In some embodiments, when a plurality ofworkpieces (e.g., the wafer S1, the wafer pod S2, and the photomask boxS3 as shown in FIG. 2) are stored in the workpiece container 100, theidentification module 300 may find out the demanded workpiece byidentifying the workpiece itself and/or the workpiece carrier 130.

The operation R50 includes taking out the demanded workpiece from theworkpiece container 100. More specifically, after the demanded workpieceis identified, the transport module 200 may take out the demandedworkpiece itself and/or the workpiece carrier 130 that holds thedemanded workpiece. For example, when the wafer S1 is demanded, thetransport module 200 may directly take the wafer S1 out of the workpiececontainer 100. For another example, when the wafer pod S2 and/or thephotomask box S3 is demanded, the transport module 200 may move theworkpiece carrier 130 that holds the wafer pod S2 and/or the photomaskbox S3 out of the workpiece container 100, and then, unload the waferpod S2 and/or the photomask box S3 from the workpiece carrier 130.Further, the arm, the gripper 208, and other components of the transportmodule 200 described above may be selectively used to perform theoperation R50.

Additionally, after the demanded workpiece is taken out of the workpiececontainer 100, the workpiece container 100 may be transferred to the gasdistribution module 500 for adjusting the storage condition therein.Similarly, the identification module 300 may identify the content of theworkpiece container 100. Subsequently, the gas distribution module 500may adjust the storage condition inside the workpiece container 100based on the content therein. In some embodiments, since a workpieceingredient in the workpiece container 100 changes, the gas distributionmodule 500 may provide the remained workpieces with a more suitablestorage condition, such that the remained workpieces in the workpiececontainer 100 may be stored in a suitable storage condition accordingly.

The operation R60 includes classifying the workpiece after the workpieceis processed in the processing tool E1. More specifically, after thedemanded workpiece is taken out of the workpiece container 100, thedemanded workpiece may be utilized in the processing tool E1. Forexample, after the photomask box S3 is taken out, the photomask thereinmay be moved and installed on a photomask holder of an exposureapparatus. In another example, after the wafer S1 is taken out, thewafer S1 may be moved and processed in the processing tool E1. After theworkpiece is utilized in the processing tool E1, the processed workpiecemay be identified and classified according to a variety of characters(e.g., suitable storage condition) through the identification module 300and the control module 400.

The operation R70 includes positioning the workpiece in a workpiececontainer 100. In some embodiments, if the processed workpiece isdesired to be stored in substantially the same storage condition asbefore, the processed workpiece may be positioned into the originalworkpiece container 100. In some embodiments, if the processed workpiecerequires a storage condition different from before, the processedworkpiece may be positioned into another workpiece container 100.

It is noted that since the operations R80, R90, R100 of the method M2 asshown in FIG. 9 are similar to the operations S50, S80, S90 of method M1as shown in FIG. 8, descriptions for those similar operations will notbe repeated hereinafter. Through the method M2 described above, a wantedworkpiece may be transported from a stocker (or relay station) to adesignated position, and further, appropriately stored after at leastone manufacturing process is conducted thereto.

Based on the above-mentioned descriptions, various advantages may beprovided by the present disclosure. In detail, an all-in-one workpiececontainer that has a supporting structure and at least one workpiececarrier is provided to contain a variety of workpieces (e.g., wafer,wafer box, wafer pod, photomask box, photomask pod, standard mechanicalinterface (SMIF) device, finished product, and unfinished product)therein. Further, a plurality of elongated bars are configured on a topsurface of the workpiece carrier to collectively form a flat virtualplane that is adaptable to the various workpieces with different shapes.After the various workpieces are positioned in the all-in-one workpiececontainer, the content of the workpiece container may be identified, andsubsequently, the storage condition of the workpiece container may beadjusted and maintained according to the content therein. Additionally,the storage condition of the workpiece container may be monitored toensure that the storage condition is appropriately adjusted andmaintained. Consequently, the various workpieces may be respectivelygrouped based on their demands for different storage conditions and thenstored in the corresponding storage conditions, such that the storagequality of the various workpieces may be improved and the risk of mutualcontamination between various workpieces may be decreased.

In some embodiments, a method for storage a workpiece used infabrication of a semiconductor device includes disposing the workpieceon a workpiece carrier, disposing the workpiece carrier with theworkpiece in a workpiece container via a workpiece storage system,identifying a content of the workpiece container, and adjusting astorage condition inside the workpiece container in response to thecontent of the workpiece container via the workpiece storage system.

In some embodiments, a method for transferring a workpiece used infabrication of a semiconductor device includes providing a demand ofusing the workpiece via a workpiece storage system, locating a workpiececontainer containing the workpiece, transferring the workpiece containerto a processing tool, taking out a workpiece carrier that holds theworkpiece from the workpiece container via the workpiece storage system,and processing the workpiece through the processing tool.

In some embodiments, a workpiece storage system includes a workpiececontainer, a transport module, an identification module, a gasdistribution module, and a control module. The workpiece container hasan internal space for storing at least one workpiece. The transportmodule is configured to transport the workpiece container in asemiconductor fabrication facility (FAB). The identification module isconfigured to identify a content of the workpiece container. The gasdistribution module is configured to adjust a storage condition of theinternal space of the workpiece container. The control module isconnected to the transport module, the identification module, and thegas distribution module, and configured to coordinate functions of thetransport module, the identification module, and the gas distributionmodule.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for storage a workpiece used infabrication of a semiconductor device, the method comprising: disposingthe workpiece on a workpiece carrier; disposing the workpiece carrierwith the workpiece in a workpiece container via a workpiece storagesystem; identifying a content of the workpiece container; and adjustinga storage condition inside the workpiece container in response to thecontent of the workpiece container via the workpiece storage system. 2.The method of claim 1, further comprising: disposing a wafer in theworkpiece container prior to adjusting the storage condition inside theworkpiece container.
 3. The method of claim 2, further comprising:identifying the workpiece prior to disposing the workpiece carrier withthe workpiece in the workpiece container.
 4. The method of claim 1,further comprising: determining a disposing position of the workpiececarrier in the workpiece container according to a height of theworkpiece.
 5. The method of claim 1, further comprising: acquiring widthinformation of the workpiece prior to disposing the workpiece on theworkpiece carrier.
 6. The method of claim 1, wherein identifying thecontent of the workpiece container comprises: detecting the workpiececontainer through radio frequency identification (RFID), optical markrecognition (OMR), or a combination thereof.
 7. The method of claim 1,wherein adjusting the storage condition comprises: injecting a gas intothe workpiece container; and controlling at least one of temperature,humidity, gas ingredient, and total organic carbon (TOC) inside theworkpiece container by the gas.
 8. The method of claim 1, furthercomprising: cleaning the workpiece container prior to adjusting thestorage condition.
 9. The method of claim 1, further comprising:monitoring the storage condition inside the workpiece container.
 10. Themethod of claim 1, further comprising: detecting whether a gas leakissue happens to the workpiece container.
 11. The method of claim 1,further comprising: transporting and storing the workpiece container ina semiconductor fabrication facility (FAB).
 12. The method of claim 11,wherein transporting and storing the workpiece container comprises:moving the workpiece container by an automated material handling system(AMHS).
 13. A method for transferring a workpiece used in fabrication ofa semiconductor device, the method comprising: providing a demand ofusing the workpiece via a workpiece storage system; locating a workpiececontainer containing the workpiece; transferring the workpiece containerto a processing tool; taking out a workpiece carrier that holds theworkpiece from the workpiece container via the workpiece storage system;and processing the workpiece through the processing tool.
 14. The methodof claim 13, further comprising: transferring the workpiece container toa gas distribution module after taking out the workpiece carrier fromthe workpiece container.
 15. The method of claim 14, further comprising:identifying a content of the workpiece container; and adjusting astorage condition inside the workpiece container through the gasdistribution module in response to the content of the workpiececontainer.
 16. The method of claim 13, further comprising: checking ifthe workpiece in the workpiece container meets the demand aftertransferring the workpiece container to the processing tool; andtransferring the workpiece container to a stocker if the workpiece inthe workpiece container does not meet the demand.
 17. The method ofclaim 13, further comprising: checking if the workpiece in the workpiececontainer meets the demand after transferring the workpiece container tothe processing tool; and proceeding with taking out the workpiececarrier if the workpiece in the workpiece container meets the demand.18. The method of claim 13, further comprising: identifying theworkpiece in the workpiece container before taking out the workpiececarrier that holds the workpiece from the workpiece container.
 19. Themethod of claim 13, further comprising: unloading the workpiece from theworkpiece carrier after taking out the workpiece carrier.
 20. Aworkpiece storage system, comprising: a workpiece container having aninternal space for storing at least one workpiece; a transport moduleconfigured to transport the workpiece container in a semiconductorfabrication facility (FAB); an identification module configured toidentify a content of the workpiece container; a gas distribution moduleconfigured to adjust a storage condition of the internal space of theworkpiece container; and a control module connected to the transportmodule, the identification module, and the gas distribution module,wherein the control module is configured to coordinate functions of thetransport module, the identification module, and the gas distributionmodule.